Dr. Yee-wen Yen

Professor,

Department of Materials Science and Engineering,

National Taiwan University of Science and Technology,

43 Keelung Road, Sec. 4, Taipei, Taiwan, ROC.

Tel: 886-22737-6659 (02-2737-6659)

Fax: 886-22737-6544 (02-2737-6544).

Highest Education

Ph.D., Dep. of Chemical Engineering, National Tsing Hua University, Hinchu, Taiwan, 09/1997-09/2002.

M. S., Dep. of Chemical Engineering, National Tsing Hua University, Hinchu, Taiwan, 09/1995-06/1997.

B. S., Dep. of Chemical Engineering, National Tsing Hua University, Hinchu, Taiwan, 09/1991-06/1995.

• Thermodynamics
• Phase Equilibria
• Electronic Packaging
• Nanotechnology
• Thin Film Deposition
• Bulk Metallic Glass

• Gita Novian Hermana, Hsien-Ming Hsiao, Po-Cheng Kuo, Yu-Chun Li , Peter K. Liaw, Satoshi Iikubo and Yee-Wen Yen*, Phase Equilibria of the Cu-Zr-Ti Ternary Systems at 703°C and Thermodynamic Assessment and Metallic Glass Region Prediction for the Cu-Zr-Ti Ternary System, Journal of Non-Crystalline Solids, Vol. 551 (2021) 120387. https://doi.org/10.1016/j.jnoncrysol.2020.120387 .
• Yu-Chun Li, Ching-Hsun Chang, Alberto S. Pasana, Hsien-Ming Hsiao, Yee-Wen Yen*, Interfacial Reactions in the Lead-free Solder/Cu-2.0Be (Alloy 25) Couples, Journal of Electronic Materials, Vol. 50 (2021) 903-913.
• Sinn-wen Chen, Tzu-ning Kuo, Jun-xiang Liu, Pei-chia Lo, Yee-wen Yen, Phase equilibria and wetting of Al-Co-Cu and Al-Co-Ni quasicrystals, Materials Chemistry and Physics, Vol. 263 (2021) 124409.
• Getachew Feyissa Gemeda, Woei-Jyh Hwang, Toyoko Imae, Yee-Wen Yen , Femtosecond pulse laser fabrication of zinc oxide quantum clusters/nanoparticles and their electrical, optical, and chemical characteristics, Journal of Colloid and Interface Science, Vol. 614 (2022) 310-321, https://doi.org/10.1016/j.jcis.2022.01.085
• Po-Kai Chen, Yu-Ju Li, Yee-Wen Yen, Chih-Ming Chen, Influences of Impurity Incorporation in Electroplated Cu on the SnAgCu and Ni-Containing SnAgCu Solder Joints, Journal of the Electrochemical Society, Vol. 169 (2022) 052508. DOI: 10.1149/1945-7111/ ac7105
• Po-Cheng Kuo, Sin-Yi Chen, William Yu, Ryo Okumura, Yee-Wen Yen*, Satoshi Iikubo, Andromeda Dwi Laksono, Alberto S. Pasana, The Effect of Increasing Nickel Content on the Microstructure, Hardness, and Corrosion Resistance of the CuFeTiZrNix High-Entropy Alloys, Materials, Vol.15 (2022) 3098. https://doi.org/10.3390/ma15093098
• Chiao-Yi Yang, Andromeda Dwi Laksono, Yee-Wen Yen*, Yi-Zhen Guo, Chu-Hsuan Wang, Jia-Lin L, Tzu-Yang Chiang, Investigation of phase equilibria of the Au-Ni-Sn ternary system and interfacial reactions in the Au/Sn/Ni/Cu multilayer couple, Materials Chemistry and Physics, Vol. 289 (2022) 126494. https://doi.org/10.1016/j.matchemphys.2022.126494
• Andromeda Dwi Laksono, Tzu-Yang Tsai, Tai-Hsuan Chung, Yong-Chi Chang, Yee-Wen Yen *, Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates, Metals , Vol 13 (2023) 12. https://doi.org/10.3390/met13010012
• Andromeda Dwi Laksono, Lutfi Yunus Wahab Al-Audhah, Chih-Ming Chen, Yu Xuan Ho, Yee-Wen Yen*, Solid/Solid State Interfacial Reactions in the Sn-9Zn/Cu-based Alloys (C1990 HP, Alloy 25, and C194) Couples, JOM, Vol. 75 (2023) 1889-1901.
• Tzu-Yang Chiang, Yong-Chi Chang, Chao-HongWang, Andromeda Dwi Laksono, Yee-Wen Yen*, Investigation of the Interfacial Reactions between the CoCuFeNi High Entropy Alloy and Sn Solder, Metals, Vol. 13 (2023) 710. https://doi.org/10.3390/met13040710
• Mavindra Ramadhani, Andromeda Dwi Laksono, Chien-Lung Liang, Chiao-Yi Yang, Kuo-Jung Chen, Yee-Wen Yen*, Hsien-Ming Hsiao, Phase Equilibria of the Ag-Al-Au Ternary system and Interfacial Reactions in the Au-xAg/Al couples at 450°C, Materials, Vol. 16 (2023), 7196. https://doi.org/10.3390/ma16227196 (2023)
• Andromeda Dwi Laksono, Chih-Ming Chen, Yee-Wen Yen*, Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) couple, Soldering & Surface Mount Technology, Vol. 36 (2024) 30. DOI: 10.1108/SSMT-05-2023-0027
• Yee-Wen Yen*, Andromeda Dwi Laksono, Yi-Chin Liou, Mavindra Ramadhani, Yu-Yen Lee, Ssu-Chi Huang, Solid/solid state interfacial reactions in the lead-free solders/Cu- 2.3%wt. Fe alloy (C194) couples, Journal of the Taiwan Institute of Chemical Engineers, Vol. 155 (2024) 105278. DOI: https://doi.org/10.1016/j.jtice.2023.105278
• Chao-Hong Wang, Kuan-Ting Li, Yee-Wen Yen, Effects of Minor Ga Addition on Interfacial Reactions Between Sn-Ga Solders and Cu, JOM, Vol. 76 (2024) 2731. https://doi.org/10.1007/s11837-024-06453-1
• Andromeda Dwi Lakson, Yu-An Shen, Ting Chen, Yee-Wen Yen*, Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe (C19210) Substrates in Molten Sn-9 wt.%Zn Solder, JOM, Vol. 76 (2024) 2754. DOI: 10.1007/s11837-024-06426-4
• Yu-Ju Li, Yee-Wen Yen, Chih-Ming Chen, Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu, Materials, Vol. 17 (2024) DOI 10.3390/ma17092149.
• Yee-wen Yen*, Andromeda Dwi Laksono, Chien-Lung Liang, Chia-Ming Hsu, Ssu-Chen Pan, Satoshi Iikubo, Dissolution Behavior of the Cu-2.0 wt.% Be Alloy (Alloy 25) in Molten Sn, Sn-3.0 wt.% Ag-0.5 wt.% Cu, and Sn-58 wt.% Bi Lead-free Solders, JOM, Vol. 77 (2025) 4192. DOI: 10.1007/s11837-025-07324-z
• Ting Chen, Yi-Chin Liou, Hsien-Ming Hsiao, Yee-wen Yen*, Liquid/solid interfacial reactions between lead-free solders and Cu-Ni-Si-Mg alloy (C7025), Journal of Materials Science-Materials in Electronics, Vol. 36 (2025) DOI: 10.1007/s10854-025-15075-5
• Yee-wen Yen*, Mavindra Ramadhani, Chih-Ming Chen, Yu-En Huang, Hsien-Ming Hsiao, Hsiang Yu Chiu, Liquid/Solid Interfacial Reactions between Lead-free Solders and Cu-6.01wt.% Sn-0.12wt.%P Alloy, Journal of Electronic Materials (accepted, 2025)

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